Resumo

MAHARAJ, D.; MOYO, T.  e  PETERSEN, J.. Ammonium thiosulfate leaching of gold from electronic printed circuit boards - effect of solution copper concentration. J. S. Afr. Inst. Min. Metall. [online]. 2024, vol.124, n.12, pp.711-718. ISSN 2411-9717.  https://doi.org/10.17159/2411-9717/724/2024.

This study investigates the effect of ammonium thiosulfate on the leaching of gold from the contacts of unpopulated cut electronic printed circuit boards (PCBs). Studies in the literature show ammonium thiosulfate to be a viable option in comparison to the commonly used but hazardous cyanide leaching route. However, the simultaneous dissolution of Cu interferes with the Au leaching reaction, often limiting the extraction to moderate levels. To optimize the system, an ammonium-thiosulfate system containing 0.5M ammonia, 0.5M ammonium thiosulfate, and Cu(II) sulfate at varying concentrations was studied as an alternative hydrometallurgical option for the recovery of gold from PCB. Tests were done with unpopulated standardized model PCBs (cut to 15 x 30mm pieces). Gold extraction of 47.3% was achieved after a 24-hour leaching experiment with a 0.02M copper background concentration. Further experiments focused using different initial background Cu concentrations (0M - 0.1M) to determine its effect on both gold and copper extractions. An initial Cu concentration of 0.045M resulted in the highest gold extraction, with 93.7% extraction after 6 hours of leaching. Further analysis of the data shows that the kinetic rate of gold leaching is correlated in a first-order dependence with the actual copper concentration in the solution, which increases with the concomitant dissolution of copper and gold from the PCBs. A lower threshold of 0.017M and an upper threshold of 0.15M copper in solution were determined, in between which gold extraction shows this first-order rate increase. The upper threshold is potentially linked to the onset of copper precipitation, which blinds the metal surfaces, slowing further leaching. The findings of this study suggest that in an industrial recovery operation of gold from waste PCB using the thiosulfate method, copper concentrations need to be carefully monitored, and the process should preferably operate with uncut or coarsely cut untreated boards to minimize exposure to copper circuits.

Palavras-chave : leaching; gold; copper; printed circuit boards; thiosulfate.

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